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gl 816e usb 2.0 9 - in - 1 card reader controller datasheet revision 1. 3 2 feb . 01 , 200 5 g enesys l ogic , i nc . ( datasheet : )
GL816E usb 2.0 9 - in - 1 card reader contro ller ?2000 - 200 5 genesys logic inc. - all rights reserved. page 2 copyright: copyright ? 200 5 genesys l ogic incorporated. all rights reserved. no part of the materials may be reproduced in any form or by any means without prior written consent of genesys l ogic inc.. disclaimer : all materials are provided "as is" without express or implied warranty of any kind. no license or right is granted under any patent or trademark of genesys logic inc.. genesys logic hereby disclaims all warranties and conditions in regard to materials, including all warranties, implied or express, of merchantability, fitness for any particular purpose, and non - infringement of intellectual property , including, without limitation, the x - d picture card tm license . in no event shall genesys logic be liable for any damages including, without limitation, damages resulting from loss of information or profits. please be advised that the materials may contain errors or ommisions. genesys logi c may make changes to the materials or to the products described therein at any time without notice. trademarks: is a registrated trademark of genesys l ogic inc.. all trademarks are the properties of their respective owners. office: genesys logic, i nc. 12f, no. 205, sec. 3, beish i n rd., shindian city, taipei, taiwan tel: (886 - 2) 8913 - 1888 fax: (886 - 2) 6629 - 6168 http://www.genesyslogic.com
GL816E usb 2.0 9 - in - 1 card reader contro ller ?2000 - 200 5 genesys logic inc. - all rights reserved. page 3 revision history revision date d escription 1.00 10/0 6/2003 first formal release 1.10 10/15/2003 add ed 128 - pin pqfp package data 1.11 11/05/2003 add ed usb2.0 certified test id in chapter 2 features 1.12 04/06/2004 change d pin 45 and pin 118 pin description 1.13 04/09/2004 1. changed pin no. for nvma15, x o, xi and avdd2 in table 3.2 2. added company logo in package dimension. 1.14 05/28/2004 updated dc characteristics in chapter 6 1.15 06/16/2004 1. added media memory card type in chapter 1 and 2. 2. removed nand flash memory interface. 3. changed table 6.2 - dc characteristics value. 1.20 06/25/2004 1. changed table 6. 1 - absolute maximum ratings value. 2. added reset timing in chapter 6.3 . 1.21 07/15/2004 1. added cf card information in chapter 2. 2. added cf timing in chapter 6.3 . 1.22 11/18/2004 re moved pcmcia interface. a. changed pcce2z to cfce2z; pcmcia ce2# to cf ce2# . b. changed pcce1z to cfce1z; pcmcia ce1# to cf ce1# . c. remove d pcmcia address 10~3 . 1.23 12/06/2004 1. changed chapter 6.3.8 reset timing 2. changed 54 pin name from sd_wpz to s d_wp 3. changed chapter 3.3 pin descriptions 1.30 01/18/2005 1. changed table 6.1 - absolute maximum ratings 2. added table 6.2 - operating conditions 3. added ac c haracteristics chapter 6.4.4 xd - picture 1. 3 1 01 / 21 /200 5 added chapter 6. 4.10 93c46 timing 1. 3 2 0 2 / 01 /200 5 changed power pin description in table 3.2
GL816E usb 2.0 9 - in - 1 card reader contro ller ?2000 - 200 5 genesys logic inc. - all rights reserved. page 4 table of contents chapter 1 general d escription ................................ ................................ ........... 6 chapter 2 features ................................ ................................ ................................ ....... 7 chapter 3 pin assig nment ................................ ................................ ......................... 9 3.1 p inouts ................................ ................................ ................................ ............................... 9 3.2 p in l ist ................................ ................................ ................................ ............................. 11 3 .3 p in d escriptions ................................ ................................ ................................ ............ 12 chapter 4 block dia gram ................................ ................................ ...................... 15 chapter 5 functiona l description ................................ ................................ . 16 5.1 utm ................................ ................................ ................................ ................................ .. 16 5.2 sie ................................ ................................ ................................ ................................ ..... 16 5.3 ep0 fifo ................................ ................................ ................................ .......................... 16 5.4 ep3 fifo ................................ ................................ ................................ .......................... 16 5.5 b ulk fifo ................................ ................................ ................................ ....................... 16 5.6 mhe (m edia h ardware e ngine ) ................................ ................................ .............. 16 chapter 6 elect rical characteristic s ................................ ...................... 17 6.1 a bsolute m aximum r atings ................................ ................................ ...................... 17 6.2 o perating c onditions ................................ ................................ ................................ . 17 6.3 dc c haracteristics ................................ ................................ ................................ .... 17 6.4 ac c haracteristics ................................ ................................ ................................ .... 18 6.4.1 utmi transceiver ................................ ................................ ................................ .. 18 6.4.2 external flash ................................ ................................ ................................ ......... 18 6.4.3 smartmedia ................................ ................................ ................................ ............. 18 6.4.4 xd - picture ................................ ................................ ................................ ................ 19 6.4.5 memory stick ................................ ................................ ................................ .......... 20 6.4.6 memory stick pro ................................ ................................ ................................ . 21 6.4.7 secure digital / multimedia card ................................ ................................ ........ 21 6.4.8 compactflash card ................................ ................................ ............................... 21 6.4.9 reset timing ................................ ................................ ................................ ............ 22 6.4.10 93c46 timing ................................ ................................ ................................ ........ 23 chapter 7 package d imension ................................ ................................ ............. 24 chapter 8 ordering information ................................ ................................ .... 26
GL816E usb 2.0 9 - in - 1 card reader contro ller ?2000 - 200 5 genesys logic inc. - all rights reserved. page 5 list of figures f igure 3.1 - 128 p in lqfp p inout d iagram ................................ ................................ .... 9 f igure 3.2 - 128 p in pqfp p inout d iagram ................................ ................................ ... 10 f igure 4.1 - b lock d iagram ................................ ................................ ............................. 15 f igure 6.1 - t iming d iagram of e xternal f lash ................................ ....................... 18 f igure 6.2 - t i ming d iagram of s mart m edia ................................ ............................. 18 f igure 6.3 - t iming d iagram of x d - p icture ................................ ................................ 19 f igure 6.4 - t iming d iagram of m emory s tick ................................ ........................... 20 f igure 6.5 - t iming d iagram of m emory s tick pro ................................ ................. 21 f igure 6.6 - t iming d iagram of sd / mmc ................................ ................................ ... 21 f igure 6.7 - t iming d iagram of c ompact f lash ................................ ......................... 21 f igure 6.8 - t iming d iagram of r eset ................................ ................................ ........... 22 f igure 6.9 - t iming d iagram of 93 c46 ................................ ................................ ........... 23 f igure 7 .1 - gl81 6e 128 p in lqfp p ackage ................................ ................................ . 24 f igure 7 . 2 - gl81 6e 128 p in p qfp p ackage ................................ ................................ . 25 lis t of tables t able 3.1 - p in l ist ................................ ................................ ................................ .............. 11 t able 3.2 - p in d escriptions ................................ ................................ ............................. 12 t able 6.1 - a bsolute m aximum r atings ................................ ................................ ....... 17 t able 6.2 - o perating c onditions ................................ ................................ .................. 17 t able 6.3 - dc c haracteristics ................................ ................................ ...................... 17 t able 8.1 - o rdering i nformation ................................ ................................ ................. 26
GL816E usb 2.0 9 - in - 1 card reader contro ller ?2000 - 200 5 genesys logic inc. - all rights reserved. page 6 chapter 1 general description the GL816E is a highly integrated, flexible application usb 2.0 multi - interface f lash c ard r eader controll er. it supports usb 2.0 high - s peed transmission to compactflash tm (cf) type i/ii , micro drive, secure digital tm (sd) , mini sd tm , multimediacard tm (mmc) , rs multimediacard tm ( rs mmc) , memory stick tm (ms), memory stick duo tm (ms duo), high speed memory stic k tm ( hs ms) , memory stick p ro tm (ms p ro ), memory stick pro tm duo (ms pro duo) memory stick rom, smartmedia tm (sm) 5v/3.3v , and xd - picture card tm (xd) on one chip. besides the flash card interface controller each, the GL816E integrates genesys logic own de sign usb 2.0 high - speed utmi ( u sb 2.0 t ransceiver m acrocell i nterface) transceiver. as a single chip solution for usb 2.0 multi flash card reader, the GL816E complies with universal serial bus specification rev. 2.0, usb storage class specification ver.1.0 , and flash card interface specification each. the GL816E can support different kinds of multi - interface combinations . f or the best performance consideration , the GL816E integrates high efficiency card interface hardware engine for data transfer, and the 4 8mhz feature - enhanced 8051 micro - controller. the GL816E also s upports firmware upgrade via usb interface, and external flash read/ write for firmware upgrade and other applications. the GL816E pin assignment design fits to card sockets to provide easier pcb layout. with two package types, the 128 - pin lqfp (14mm x 14mm) and the 128 - pin pqfp (14mm x 20mm), t he GL816E can fit your various design in both standalone and pc embedded usb 2.0 multi - interface flash card reader / writer applications.
GL816E usb 2.0 9 - in - 1 card reader contro ller ?2000 - 200 5 genesys logic inc. - all rights reserved. page 7 chapter 2 features l usb specification compliance - complies with 480mbps universal serial bus specification rev. 2.0. - complies with usb storage class specification rev. 1.0. - supports 1 device address and up to 10 endpoints : control (0)/ bulk read (1) / bulk write (2)/ interrupt (3), and 3 optional bulk read/ write endpoints pair. l integrated usb building blocks - integrated usb 2.0 transceiver macrocell interface (utmi) transceiver and serial interface engine (sie). - build - in power - on reset (por) and low - v oltage detector (lvd) . l embedded 8051 micro - controller - operate @ 48 mhz clock. - embedded 32k byte mask rom and internal 256 byte sram. - supports up to external 64k rom/ flash for design flexibility. l support firmware upgrade to external flash via usb interface l usb 2.0 certified (testid= 40 390389) l support all kinds of flash card interface - smartmedia / xd - picture card interface - memory stick / memory stick pro card interface - secure digital / multimediacard interface - compactflash type i/ii l 3.3v operation l flexible pi n utilization - dedicated power control pins and programmable card - enable pins. - supports 4(or more) gpio pins for design flexibility. - pin assignment fits to card sockets for easy pcb layout. - shared pins for smartme dia tm interface . l smartmedia tm interface - addr ess support up to 4 bytes, 8 bit data width and different speed - support s different page size, and automatic append redundant area data (8 / 16 bytes) - hardware ecc encoding and decoding capability - support s firmware correct page ecc error capability - complian t with xd - picture card l xd - picture card tm interface - complies with xd - picture tm interface specification - compliant smartmedia tm interface l memory stick tm (ms) / memory stick duo tm (ms duo) / high speed memory stick tm ( hs ms) / memory stick p ro tm (ms p ro ) / mem ory stick pro tm duo (ms pro duo) memory stick rom interface - compl ies with memory stick standard memory stick pro format s pecification s ver 1.00 - 01 - complies with m e mory stick format specifications ver 1.40 - 00 - hardware support 4 - bit hs memory stick pro inte rface - support s ins signal - support s automatic crc16 generation and verificati on - support s different clock rate up to 40 mhz l secure digital tm , mini sd tm and multimediacard tm - compl ies with secure digital tm / multimediacard tm interface specification - support s b oth sd / mmc mode access clk/cmd/dat0/dat1/dat2/dat3 - command transmit and response receive can be enabled separately
GL816E usb 2.0 9 - in - 1 card reader contro ller ?2000 - 200 5 genesys logic inc. - all rights reserved. page 8 - automatic crc7 generation for command and crc7 verification for response on cmd - support automatic crc16 generation and verification on dat3 - 0 - in addition to full packet transaction, optional single byte / bit operation on both cmd and dat line / lines - da ta processing in block or byte - support s different clock rate from 375 khz to 24 mhz l high efficient hardware engine - automatic data read / writ e with card by hardware engine - easier firmware development - media interface signals output low automatically when suspend l inter - media transfer capability - support data copy between flash cards or in the same flash memory card l support external ice / micro - con troller interface - easy firmware development environment - easy operate by external robust microprocessor l available in 128 - pin lqfp and 128 - pin pqfp package
GL816E usb 2.0 9 - in - 1 card reader contro ller ?2000 - 200 5 genesys logic inc. - all rights reserved. page 9 chapter 3 pin assignment 3.1 pinouts GL816E lqfp - 128 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 2 3 4 5 6 7 nvma15 xd_cdz/gpio13 nvmwez nvma14 gpio7 cf_oez/gpio16 cf_iorz gpio6 cf_iowz dgnd0 udvcc1 udvcc1 udgnd0 udgnd0 rpu avdd1 vpf vph vmf vmh agnd1 agnd1 rref avdd2 xo nvma12 nvma7 nvma6 nvma5 nvma4 pcce2z gpio15 1 8 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 95 94 93 92 91 90 89 96 ms_d1 cf/sm_d1 cf_wez/gpio17 dgnd2 nvmd0 nvmd1 nvmd2 nvmd3 cf/sm_d0 sm_cdz ms_d0 ms_d2 dvdd2 cf_a0 cf_a1 gpio18 ms_d3 cf_a2 nvmd4 nvmd5 extrstz 93c46_di 93c46_do sm_ale sd_d0 cf_d8 cf_d9 ms_ins sm_cle cf_d10 cf_intrqz cf_d11 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 63 62 61 60 59 58 57 64 nvmd7 nvmcsz nvma10 sd_wp sd_cdz sm_wez sm_rbz dgnd1 nvmoez nvma11 nvma9 nvma8 dvcc1 ms_clk sm_wpz smpctl/gpio11 gpio3 gpio4 nvma13 gpio14 gpio5 udgnd1 udvcc1 ugnd2 xi nvmd6 sd_d1 sm_rez gpio2 gpio1 gpio0 cf_rst 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 98 99 100 101 102 103 104 97 cf/sm_d4 cf_regz cf_cdz sm_wpdz cf/sm_d5 cf_d13 sd_clk sd_cmd cf/sm_d6 cf_d14 cf/sm_d7 cf_d15 sd_d3 sd_d2 dvcc3 nvma0 nvma1 dgnd3 nvma2 nvma3 93c46_sk 93c46_cs xdpctl/gpio12 gpio8 cfce1z cf/sm_d3 mspctl/gpio10 sdpctl/gpio9 ms_bs cf/sm_d2 cf_waitz cf_d12 figure 3 .1 - 128 pin lqfp pinout diagram
GL816E usb 2.0 9 - in - 1 card reader contro ller ?2000 - 200 5 genesys logic inc. - all rights reserved. page 10 GL816E pqfp - 128 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 2 3 4 5 6 7 nvma15 xd_cdz/gpio13 nvmwez nvma14 gpio7 cf_oez/gpio16 cf_iorz gpio6 cf_iowz dgnd0 udvcc1 udvcc1 udgnd0 udgnd0 rpu avdd1 vpf vph vmf vmh agnd1 agnd1 rref avdd2 xo nvma12 nvma7 nvma6 nvma5 nvma4 cfce2z gpio15 1 8 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 101 100 99 98 97 96 95 102 cf_intrqz cf_d10 sm_cle ms_ins cf_d9 cf_d8 ms_d1 cf/sm_d1 cf_wez/gpio17 dgnd2 nvmd0 nvmd1 nvmd2 nvmd3 cf/sm_d0 sm_cdz ms_d0 ms_d2 dvdd2 cf_a0 cf_a1 gpio18 ms_d3 cf_a2 nvmd4 cf_d11 cf_d12 cf_waitz cf/sm_d2 ms_bs sdpctl/gpio9 mspctl/gpio10 50 49 48 47 46 45 44 43 42 41 40 39 57 56 55 54 53 52 51 58 sm_rbz dgnd1 nvmoez nvma11 nvma9 nvma8 dvcc1 ms_clk sm_wpz smpctl/gpio11 gpio3 gpio4 nvma13 sm_wez sd_cdz sd_wp nvma10 nvmcsz nvmd7 nvmd6 111 112 113 114 115 116 117 118 119 120 121 104 105 106 107 108 109 110 103 sd_clk sd_cmd cf/sm_d6 cf_d14 cf/sm_d7 cf_d15 sd_d3 sd_d2 dvcc3 nvma0 nvma1 dgnd3 cf_d13 cf/sm_d5 sm_wpdz cf_cdz cf_regz cf/sm_d4 cf/sm_d3 33 xi 34 ugnd2 35 udvcc1 36 udgn1 37 gpio5 38 gpio14 60 59 61 sd_d1 sm_rez gpio2 63 62 64 gpio1 gpio0 cf_rst 68 67 66 65 93c46_di 93c46_do sm_ale sd_d0 70 69 nvmd5 extrstz 125 126 127 128 93c46_cs xdpctl/gpio12 gpio8 cfce1z 123 124 nvma3 93c46_sk 122 nvma2 figure 3.2 - 128 pin pqfp pinout diagram
GL816E usb 2.0 9 - in - 1 card reader contro ller ?2000 - 200 5 genesys logic inc. - all rights reserved. page 11 3.2 p in list table 3.1 - pin list pin# pin name type pin# pin name type pin# pin name type pin# pin name type 1 gpio15 b 33 xi i 6 5 sd_d0 b/so 97 cf_d12 b 2 cf ce2z b/o 34 ugnd2 p 66 sm_ale o 98 cf_waitz i/so 3 nvma4 o 35 udvcc1 p 67 93c46_do b/i 99 cf/sm_d2 b 4 nvma5 o 36 udgnd1 p 68 93c46_di b/o 100 ms_bs o 5 nvma6 o 37 gpio5 b/o 69 extrstz i 101 sdpctl/ gpio9 b/o 6 nvma7 o 38 gpio14 b 70 nvmd5 o 102 mspctl/ gpio10 b/o 7 nvma12 o 39 nvma13 o 71 nvmd4 o 103 cf/sm_d3 b 8 nvma15 o 40 gpio4 b/o 72 cf_a2 o 104 cf/sm_d4 b 9 xd_cdz/ gpio13 b/i 41 gpio3 b/o 73 ms_d3 b 105 cf_regz b/o 10 nvmwez o 42 smpctl/ gpio11 b/o 74 gpio18 b 106 cf_cdz b/i 11 nvma14 o 43 sm_wpz o 75 cf_a1 o 107 sm_wpdz b/i 12 gpio7 b/o 44 ms_clk o 76 cf_a0 o 108 cf/sm_d5 b 13 cf_oez/ gpio16 b/o 45 dvcc1 p 77 dvdd2 p 109 cf_d13 b 14 cf_iorz o 46 nvma8 o 78 ms_d2 b 110 sd_clk o 15 gpio6 b/o 47 nvma9 o 79 ms_d0 b 111 sd_cmd b/so 16 cf_iowz o 48 nvma11 o 80 sm_cdz b/i 112 cf/sm_d6 b 17 dgnd0 p 49 nvmoez o 81 cf/sm_d0 b 113 cf_d14 b 18 udvcc1 p 50 dgnd1 p 82 nvmd3 o 114 cf/sm_d7 b 19 udvcc1 p 51 sm_rbz b/i 83 nvmd2 o 115 cf_d15 b 20 udgnd0 p 52 sm_wez o 84 nv md1 o 116 sd_d3 b 21 udgnd0 p 53 sd_cdz b/i 85 nvmd0 o 117 sd_d2 b 22 rpu a 54 sd_wp b/i 86 dgnd2 p 118 dvcc3 p 23 avdd1 p 55 nvma10 o 87 cf_wez/ gpio17 b/o 119 nvma0 o 24 vpf b 56 nvmcsz o 88 cf/sm_d1 b 120 nvma1 o 25 vph b 57 nvmd7 o 89 ms_d1 b 121 dgnd3 p 26 vmf b 58 nvmd6 o 90 cf_d8 b 122 nvma2 o 27 vmh b 59 sd_d1 b/so 91 cf_d9 b 123 nvma3 o 28 agnd1 p 60 sm_rez o 92 ms_ins b/i 124 93c46_sk b/o 29 agnd1 p 61 gpio2 b/o 93 sm_cle o 125 93c46_cs b/ o 30 rref a 62 gpio1 b/o 94 cf_d10 b 126 xdpctl/ gpio12 b/o 31 avdd2 p 63 gpio0 b/o 95 cf_intrqz b/i 127 gpio8 b 32 xo b 64 cf_rst b 96 cf_d11 b 128 cf ce1z b/o
GL816E usb 2.0 9 - in - 1 card reader contro ller ?2000 - 200 5 genesys logic inc. - all rights reserved. page 12 3.3 p in d escriptions table 3.2 - pin descriptions usb interface pin name pin# type d escription nvma15~0 8 ,11,39,7, 48,55,47, 46,6~3, 123,122 , 120,119 o ext. flash address 15~0 nvmwez 10 o ext. flash we# rpu 22 a usb resistor pull up vpf 24 b fs d+ vph 25 b hs d+ vmf 26 b fs d - vmh 27 b hs d - rref 30 a reference resistor x o 32 i crystal input x i 33 b crystal output nvmoez 49 o ext. fl ash oe# nvmcsz 56 o (pu) ext. flash cs# nvmd7~0 57,58,70, 71,82~85 b (pd) ext. flash data 7~0 extrstz 69 i (pu) external reset #, the active low signal is used by the system to reset the chip . the active low pulse should be at least 1 us wide. memory interface pin name pin# type d escription cf c e2z 2 b/i (pu) cf ce2# xd_cdz 9 b/i (pu) xd cd# , this is the card detection signal from xd - picture device to indicate if the device is inserted, normal high. cf_iorz 14 o cf ior# cf_iowz 16 o cf iow# cf_oez 13 o cf oe# sm_pctl 42 b/o smartmedia power control sm_wpz 43 o smartmedia wp#, this pin is an active low write protect signal for the sm device, when smc is enabled. normal high. ms_ clk 44 o memory stick sclk output sm_rbz 51 b/i (pu) smartmedia rdy/ bsy#
GL816E usb 2.0 9 - in - 1 card reader contro ller ?2000 - 200 5 genesys logic inc. - all rights reserved. page 13 sm_wez 52 o smartmedia we# sd_cdz 53 b/i (pu) sd card detection#, this is the card detection signal from sd device to indicate if the device is inserted, normal high. sd_wp 54 b/i (pu) sd write protect detection, this pin is an active high write pr otect signal for the sd device, when sd is enable. n ormal low. sd_d0~3 65,59,117, 116 b/so (pu) sd dat0~3 sm_rez 60 o smartmedia re# cf_rst 64 b (pd) cf reset sm_ale 66 o smartmedia ale cf_a2~0 72,75,76 o cf address 2~0 ms_d3~0 73,78,89, 79 b/so (pu) ms dat3~0 sm_cdz 80 b/i (pu) smartmedia cd#, this is the card detection signal from sm device to indicate if the device is inserted, active low. cf/sm_d0~7 81,88,99, 103,104, 108,112, 114 b/so (pu) cf / smartmedia dat0~7 cf_wez 87 o cf we# cf_d8~15 90, 91,94, 96,97,109, 113,115 b/i (pu) cf dat8~15 ms_ins 92 b/i (pu) memory stick ins sm_cle 93 o smartmedia cle cf_intrqz 95 b/i cf intrq# cf_waitz 98 i/so (pu) cf wait# ms_bs 100 o memorystick bs sd_pctl 101 b/o sd /mmc power control ms_pctl 102 b/o m e mory stick power c ontrol cf_regz 105 b/o (pu) cf reg# cf_cdz 106 b/i (pu) cf cd# . cf card detection, this pin is connected to the ground on the cf card, when the cf device is inserted. sm_wpdz 107 b/i (pu) smartmedia write protect detect, this pin is a n active low write protect signal for the sm device, when sm is enable. n ormal high. sd_clk 110 o sd/mmc clk sd_cmd 111 b/so (pu) sd/mmc cmd xd_pctl 126 b/o xd power control cfc e1z 128 b/i (pu) cf ce1#
GL816E usb 2.0 9 - in - 1 card reader contro ller ?2000 - 200 5 genesys logic inc. - all rights reserved. page 14 eeprom interface pin name pin# type d escrip tion 93c46_do 67 b/i 93c 4 6 data out 93c46_di 68 b/o 93c46 data in 93c46_sk 124 b/o 93c46 clock 93c46_cs 125 b/o 93c46 cs miscellaneous interface pin name pin# type d escription gpio1 8~0 74,87,13,1, 38,9,126, 42,102,101, 127,12,15, 37,40,41, 61,62,63 b (odpu) gpio 18~0 power / ground pin name pin# type d escription dgnd0~3 17,50,86, 121 p digital gnd # 0~3 udvcc1 18,19 ,35 p utmi digital vcc udgnd0~1 20,21,36 p utmi digital gnd avdd1 23 p analog vdd #1 agnd1 28,29 p analog gnd #1 avdd2 3 1 p analog vdd #2 ugnd2 34 p utmi gnd dvcc1,3 45,118 p digital vdd #1, 3 dvdd2 77 p digital vdd #2 notation : type o output i input b bi - directional b/i bi - directional, default input b/o bi - directional, default output p power / grou nd a analog so automatic output low when suspend pu internal pull up pd internal pull down odpu open drain with internal pull up
GL816E usb 2.0 9 - in - 1 card reader contro ller ?2000 - 200 5 genesys logic inc. - all rights reserved. page 15 chapter 4 block diagram data a data b txfifo rxfifo data a data b ep0 fifo ep3 fifo sie utm 8051 core sram usb register + fifo control mask rom mcfifo mhe mhe control cf mif ms/ms pro mif sd/mmc mif sm/xd mif figure 4.1 - block diagram
GL816E usb 2.0 9 - in - 1 card reader contro ller ?2000 - 200 5 genesys logic inc. - all rights reserved. page 16 chapter 5 fu nctional description 5.1 utm the usb 2.0 transceiver macrocell, it? s t he analog circuitry that handles the low level usb protocol and signaling, and shifts the clock domain of the data from the usb 2.0 rate to one that is compatible with the general logic. 5.2 sie the serial interface engine, which contains the usb pid and address recognition logic, and other sequencing and state machine logic to handle usb packets and transactions. 5.3 ep0 fifo it is composed of tx0fifo and rx0fifo, with 64 - byte fifo each, and it is used for endpoint 0 data transfer. 5.4 ep3 fifo i t?s an 8 - byte fifo for endpoint 3. 5.5 bulk fifo it is composed of txfifo and rxfifo for data transm ission and receiving respectively, also with different modes support: txfifo: 1. to ensure the cont inuous data transmi ssion, txfifo includes 512 bytes data - a fifo, 512 bytes data - b fifo, and two 16 bytes corresponding redundant areas . all can be directly accessed by 8051 c. 2. normally sie popes data, mhe pushes data for data a/b fifos, and redundant area is pushed by mhe when smartmedia mif is enabled and popped by uc. 3. supports uc single byte access for smartmedia ecc error correction. 4. at transmit mode sie won?t transmit data filled in txfifo before uc complete the data integrity checking. r xfifo: 1. to ensu re the continuous data transmi ssion, r xfifo includes 512 bytes data - a fifo, 512 bytes data - b fifo, and 16 bytes single redundant area . all can be directly accessed by 8051 c. 2. normally mhe popes data, sie pushes data for data a/b fifos, and redundant area is pushed by uc and popped by mhe when smartmedia mif is enabled . buffer mode: 1. buffer mode is enabled by firmware and is used to copy data block from source to destination in same card for smartmedia or memory stick application s. 2. under buffer mode, firmwar e can enable mif to read source data block to txfifo, check the data integrity, then enable mif to write data in txfifo to destination data block space on memory card . 3. for smartmedia application , the redundant data write to destination data block space is from redundant area of rxfifo . 5.6 mhe (media hardware engine) the media hardware e ngine contains 4 mif (media interface), mhe control and mcfifo. 1. mif (media interface): there are compactflash mif, memory stick/ memory stick pro mif, secure digital/ multim ediacard mif and smartmedia/ xd - picture card mif in mhe. 2. mcfifo (media control fifo): it ? s a 64 - byte fifo that shared by memory stick/ memory stick pro and sd/ mmc mif. in memorystick application, the mcfifo is used for register read and write function; in sd/ mmc application, it is used for command and response. 3. smafifo ( smartmedia tm address fifo ): it ? s a 4 - byte fifo for smartmedia address only .
GL816E usb 2.0 9 - in - 1 card reader contro ller ?2000 - 200 5 genesys logic inc. - all rights reserved. page 17 chapter 6 electrical characteristics 6.1 absolute maximum ratings table 6.1 - absolute maximum ratings paramete r value storage temperature - 65 c to +150 c ambient temperature - 40 c to +80 c supply voltage to ground potential - 0.5v to + 4.0 v dc input voltage to any pin - 0.5v to + 5.8 v 6.2 operating conditions table 6. 2 - operating conditions parameter value t a (ambient temperature under bias) 0 c to 70 c supply voltage +3. 0 v to +3.6v ground voltage 0v f osc (oscillator or crystal frequency) 12 mhz 0.25% 6. 3 dc c haracteristics table 6. 3 - dc characteristics symbol parameter condition min. typ. max. unit v cc supply voltage 3.0 3.3 3.6 v v ih input high voltage 2.6 - 5 v v il input low voltage 0.0 - 0.7 v i i input leakage current 0 < v in < v cc - 10 - 10 m a v oh output high voltage 3.0 - - v v ol output low voltage - - 0.2 v i oh output current high vd d=3.3v v oh =2.6v - 8.3 - ma i ol output current low vdd=3.3v v ol =0.8v - 7.8 - ma c in input pin capacitance - - 2.0 pf i susp suspend current 1.5k external pull - up included - - 280 m a i cc supply current connect to usb with 8051 operating - - 85 ma
GL816E usb 2.0 9 - in - 1 card reader contro ller ?2000 - 200 5 genesys logic inc. - all rights reserved. page 18 6. 4 ac c haracteristics 6. 4 .1 utmi transceiver the GL816E is fully compatible with universal serial bus specification rev. 2.0 and usb 2.0 transceiver macercell interface (utmi) specification rev. 1.01. please refer to the specification s for more information. 6 . 4 .2 external flash nvma[0..15] dddddxdddddddddddddddxddddd \ \ \ \ \ ; \ \ \ \ \ \ \ \ \ \ \ \ \ \ @? \ \ \ \ \ nvmoe# lllllrhhhhhhhhhhhhhhhflllll \ \ \ \ \ ; \ \ \ @; \ \ \ \ \ @ ? \ \ \ ; \ \ @ ? \ nvmwe# hhhhhhhhhhfllllllrhhhhhhhhh nvmd[0..7] dddddxddddxddddddddddxdddxd figure 6.1 - tim ing diagram of external flash parameter description min typ max unit t wc write data cycle time 102.5 t ww write pulse width 41.6 t ow oe# to we# time 38.6 t ra read access time 90 ns 6. 4 .3 smartmedia read \ \ \ \ \ ; \ \ \ \ \ \ \ \ \ \ \ \ \ @ ; \ \ \ \ \ @ ? re # hhhhhfllllllrhhhhhhhfllllllr \ \ \ \ \ \ \ \ ; \ \ @ ; \ @ ? \ \ \ \ \ \ \ \ \ \ \ \ d[0..7] zzzzzzzznddddddozzzzzzzznddd write cle lrhhhhflllllllllllllllllllll \ ; \ \ \ @ ? \ \ \ \ \ \ \ \ \ \ \ \ \ ; \ \ \ \ @ ? \ ale lllllllllrhhhhhhhfllllllllll \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ ; \ @ ? \ \ \ \ we # hhhhhhhhhhhhhhhhhhhhfllrhhfl \ ;@ ;@? \ \ \ ;@? ;@;@ ? \ \ \ \ ;@;@? \ \ d[0..7] zzzndozzzzndozndozzzzndddozn figure 6.2 - timing diagram of smartmedia twc tow tww tra tcr tds tdh trw tcw tcd tai tad tdw tdw tww t tdp tdd
GL816E usb 2.0 9 - in - 1 card reader contro ller ?2000 - 200 5 genesys logic inc. - all rights reserved. page 19 parameter description mode min typ max unit normal 165 tcw cle active width slow 198 normal 100 twc write data cycle time slow 166 normal 66 tww write pulse width slow 100 tcd cle - to - command delay 33.3 normal 67 tdw data width slow 100 tad ale - to - address delay 33.3 tai address data interval time 33.3 tdp data pre - output delay 33.3 tdd data delay time 33.3 normal 133.3 tcr read data cycle time slow 166.6 trw read pulse width 100 tds data setup time 40 tdh data hold time 2 0 ns 6.4.4 xd - picture read \ \ \ \ \ ; \ \ \ \ \ \ \ \ \ \ \ \ \ @ ; \ \ \ \ \ @ ? re# hhhhhfllllllrhhhhhhhfllllllr \ \ \ \ \ \ \ \ ; \ \ @ ; \ @ ? \ \ \ \ \ \ \ \ \ \ \ \ d[0..7] zzzzzzzznddddddozzzzzzzznddd write cle lrhhhhflllllllllllllllllllll \ ; \ \ \ @ ? \ \ \ \ \ \ \ \ \ \ \ \ \ ; \ \ \ \ @ ? \ ale lllllllllrhhhhhhhfllllllllll \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ ; \ @ ? \ \ \ \ we# hhhhhhhhhhhhhhhhhhhhfllrhhfl \ ;@ ;@? \ \ \ ;@? ;@;@ ? \ \ \ \ ;@;@? \ \ d[0..7] zzzndozzzzndozndozzzzndddozn figure 6. 3 - timing diagram of xd - picture tcr tds tdh trw tcw tcd tai tad tdw tdw tww t tdp tdd
GL816E usb 2.0 9 - in - 1 card reader contro ller ?2000 - 200 5 genesys logic inc. - all rights reserved. page 20 parameter description mode min typ max unit normal 165 tcw cle active width slow 198 normal 100 twc write data cycle time slow 166 normal 66 tww write pulse width slow 100 tcd cle - to - command delay 33.3 normal 67 tdw data width slow 100 tad ale - to - address delay 33.3 tai address data interval time 33.3 tdp data pre - output delay 33.3 tdd data delay time 33.3 normal 133.3 tcr read data cycle time slow 166.6 trw read pulse width 100 tds data setup time 40 tdh data hold time 20 ns 6. 4 . 5 memory stick bs llrhhhhhhhhhhhhhhhflllllll lll sclk lll rfrfrfrfrfrfrfrfrfrfrfrfrf sdio ddddxdddddddddddddddxdddddddd figure 6. 4 - timing diagram of memorystick parameter description mode typ unit remark 0 1.5m 1 6m 2 15m fck sclk frequency 3 24m hz
GL816E usb 2.0 9 - in - 1 card reader contro ller ?2000 - 200 5 genesys logic inc. - all rights reserved. page 21 6. 4 . 6 memory stick pro bs llrhhhhhhhhhhhhhhhfllllllllll sclk lll rfrfrfrfrfrfrfrfrfrfrfrfrf data dddxdxdxdxdxdxdxdxdxdxdxdxdxd figure 6. 5 - timing diagram of memorystick pro parameter description mode typ unit remark 0 30m fck sclk frequency 1 40m hz 6. 4 . 7 secure digital / multimedia card cmd dddxdxdxdddddddddddddddddxdddd clk rfrfrfrfrfrfrfrfrfrfrfrfrfrfrf dat dddddddddddddxdddddddddddxdddd figure 6. 6 - timing diagram of sd / mmc parameter description mode typ unit remark 0 375k 1 6m 2 15 m fck clk frequency 3 24m hz 6. 4 . 8 compactflash card \ \ \ ; \ \ \ \ \ \ \ \ \ \ @ ; \ \ \ \ @ ? \ \ \ \ ior - /iow - hhhflllllrhhhhhflllllrhhhh \ \ \ ; @ ? \ \ \ ; @ ? \ \ \ \ \ \ \ \ \ \ \ \ \ \ write dd[15:0] zzzzzndddddozzzzznd dd dd ozz \ \ \ \ \ \ \ ; @ ; @ ? \ \ \ \ \ \ \ \ \ \ \ \ \ \ read dd[15:0] zzz zz zzndddoz zzzzzznddd ozz figure 6. 7 - timing diagram of compactflash parameter description mode min typ max unit 0 - 665 - 1 - 416 - 2 - 266 - tcyc read/write cycle time 3 - 199 - ns tcyc thw td tw tsu thr
GL816E usb 2.0 9 - in - 1 card reader contro ller ?2000 - 200 5 genesys logic inc. - all rights reserved. page 22 0 - 332 - 1 - 166 - 2 - 132 - tw read/write active width 3 - 99 - 0 - - 0 1 - - 0 2 - - 0 td delay time for write data 3 - - 0 0 30 - 1 30 - - 2 15 - - thw data hold time following iow - 3 15 - - 0 20 - - 1 20 - - 2 20 - - tsu data setup time before ior - 3 20 - - 0 8 - - 1 8 - - 2 8 - - thr d ata hold time following ior - 3 8 - - 6. 4 . 9 reset timing extrstz t rst figure 6. 8 - timing diagram of reset parameter description minimum unit remark trst this active low signal is used by the system to reset the chip ; the active low pulse should be at least 1us wide. 1 us
GL816E usb 2.0 9 - in - 1 card reader contro ller ?2000 - 200 5 genesys logic inc. - all rights reserved. page 23 6.4.10 93c46 timing \ \ ; \ \ @ ? \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ ; \ @ ; \ \ @ ? cs llrhhhhhhhhhhhhhhhhhhhhhhhhflllr \ \ \ \ \ \ ; \ \ \ \ @ ; \ \ \ \ @ ? \ \ \ \ \ \ \ \ \ \ \ \ \ sk llllllahhhhhblllllahhhhhfllllll l \ \ \ ; z@ ; z@ ? \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ di dddxdddddxdddddxdddddxdddddddddd \ \ \ \ \ \ ;@ ? \ \ \ \ \ \ \ \ \ ;@ ? \ \ \ \ \ \ \ \ \ \ \ do hhhhhhhhflllllllllllrhhhhhh^zzzz \ \ ; \ \ @ ? \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ ;@ ? \ \ do zzzzzznddddddddddddddddddddddozz figure 6.9 - timing diagram of 93c 46 parameter description min typ max unit tskh sk high time 250 - - tskl sk low time 250 - - tcs minimum cs low time 250 - - tcss cs setup time 50 - - tdis di setup time 100 - - tcsh cs hold time 0 - - tdih di hold time 100 - - tpd1 outpu t delay to ? 1 ? - - 250 tpd0 output delay to ? 0 ? - - 250 tsv cs to status valid - - 250 tdf cs to do in high impedance - - 100 ns tskh tskl tdih tcss tcsh tpd0 tpd1 tsv tdf status valid read program tcs tdis
GL816E usb 2.0 9 - in - 1 card reader contro ller ?2000 - 200 5 genesys logic inc. - all rights reserved. page 24 chapter 7 package dimension l1 control dimensions are in millimeters. symbol millimeter inch min. nom. max. max. min. nom. a a1 a2 d e d1 e1 r2 r1 c l l1 s b e aaa bbb ccc ddd d2 e2 tolerances of form and position 16.00 basic 16.00 basic 14.00 basic 14.00 basic 0.630 basic 0.630 basic 0.551 basic 0.551 basic 0.05 1.35 1.40 1.60 0.15 1.45 0 0 11 11 3.5 12 12 7 13 13 0.08 0.08 0.20 0.003 0.003 0.008 0 0 11 11 3.5 12 12 7 13 13 0.063 0.006 0.057 0.055 0.002 0.053 0.20 0.20 0.08 0.07 0.008 0.008 0.003 0.003 0.40 basic 12.40 basic 12.40 basic 0.016 basic 0.488 basic 0.488 basic 1.00 ref 0.039 ref 0.09 0.45 0.20 0.13 0.60 0.16 0.20 0.75 0.23 0.004 0.018 0.008 0.005 0.024 0.006 0.008 0.030 0.009 0 - 0 2 - 0 3 - 0 1 - notes : 1. 2. dimensions d1 and e1 do not include mold protrusion. allowable protrusion is 0.25 mm per side. d1 and e1 are maximum plastic body size dimensions including mold mismatch. dimension b does not include dambar protrusion. allowable dambar protrusion shall not cause the lead width to exceed the maximum b dimension by more than 0.08mm. dambar can not be located on the lower radius or the foot. seating plane c c ccc 0 1 - 0 - a a2 a1 c e 0.05 d1 d2 b d a b b a d d c h aaa bbb ddd 4x 4x m c b a s s d s e e1 e2 a b d 1 128 32 33 64 65 96 97 gage plane r1 r2 0.25mm s l 0 3 - 0 2 - h xxxx xxxxx-xx g GL816E date code, yearweek lot code chip version green package figure 7 .1 - gl81 6e 128 pin lqfp package
GL816E usb 2.0 9 - in - 1 card reader contro ller ?2000 - 200 5 genesys logic inc. - all rights reserved. page 25 39 64 d e 102 65 103 128 38 1 e 1 b d 1 e l 1 detail "f" l gage plane s c see detail "f" seating plane ccc a a 1 a 2 c control dimensions are in millimeters. symbol millimeter inch min. nom. max. max. min. nom. a a1 a2 d d1 e e1 r2 r1 c l l1 s b e aaa bbb ccc ddd d2 e2 tolerances of form and position 23.20 basic 20.00 basic 17.20 basic 14.00 basic 0.913 basic 0.787 basic 0.677 basic 0.551 basic 0.25 2.50 2.72 3.40 2.90 0 0 15 ref 15 ref 7 0.13 0.13 0.005 0.005 0 0 15 ref 15 ref 7 0.134 0.114 0.107 0.010 0.098 0.20 0.20 0.08 0.08 0.008 0.008 0.003 0.003 0.50 basic 18.50 basic 12.50 basic 0.020 basic 0.728 basic 0.492 basic 1.60 ref 0.063 ref 0.11 0.73 0.20 0.17 0.88 0.20 0.23 1.03 0.27 0.004 0.029 0.008 0.007 0.035 0.008 0.009 0.041 0.011 0 - 0 2 - 0 3 - 0 1 - r1 r2 0 - 0 1 - notes : 1. 2. dimensions d1 and e1 do not include mold protrusion. allowable protrusion is 0.25 mm per side. d1 and e1 are maximum plastic body size dimensions including mold mismatch. dimension b does not include dambar protrusion. allowable dambar protrusion shall not cause the lead width to exceed the maximum b dimension by more than 0.08mm. dambar can not be located on the lower radius or the foot. minimum space between protrusion and an adjacent lead is 0.07mm. e 2 d 2 -d- -a- -b- 0 3 - 0 2 - 0.25 mm -c- aaa d d c a-b d 4x bbb d h a-b d 4x ddd m c a-b s d s 0.05 s 0.30 0.012 0.15 0.006 xxxx xxxxx-xx g GL816E date code, yearweek lot code chip version green package figure 7 . 2 - gl81 6e 128 pin p qfp package
GL816E usb 2.0 9 - in - 1 card reader contro ller ?2000 - 200 5 genesys logic inc. - all rights reserved. page 26 chapter 8 ordering information table 8.1 - ordering information part number package status GL816E 128 - pin lqfp GL816E 128 - pin pqfp

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